What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Job Description

AMD’s Packaging Engineering team is looking for an experienced IC Packaging Engineer who will help solve complex technical challenges to deliver robust, reliable, cost effective package & drive assembly solutions aligned with the end-product requirements. AMD is bolder than ever, focused and energized - you can make a career move that matters! Help turn "possibility" into "reality" every day!

Responsibilities

• Manage package development program from concept development to high volume production for next generation CPU products.
• Develop design guidelines and assembly process techniques for advanced electronic packaging
• Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities.
• Utilize hands-on expertise of assembly processes for flip chip package development.
• Coordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability.
• Perform package design and construction feasibility studies to define new package concepts based on product requirements.
• Research and develop substrate materials and manufacturing techniques, electronic packaging materials, assembly Processes, multi die stacking and 2.5D/3D package technologies
• Solve technical issues on package reliability, materials and assembly process.
• Work cross-functionally to understand trade-offs, constraints for optimizing package cost & performance.
• Represent packaging team in all relevant forums to ensure on time flawless NPI.

Skills and Experience Requirements

• BS degree in Mechanical or Chemical Engineering or Materials Science is required. MS degree is an added plus.
• Hands on 5+ years of experience in electronic package development & manufacturing is required, including FCBGA and MCM packaging for high performance server & networking products is required.
• Knowledge of flip chip assembly processes, substrate manufacturing, package reliability testing, failure analysis is required.
• Proven track record in bring-up of complex packages from design to high volume manufacturing at OSATs is required.
• Knowledge of package design using APD & electrical performance trade-offs is an added plus.
• Ability to work with FEA modeling engineers for stress analysis to optimize package construction and material selection is desirable
• Proficiency in following software is required: AutoCAD, Word, Excel, Power Point & Agile.
• Ability to work with manufacturing partners/suppliers, Business unit and customers.
• Experience working with bumping/assembly/substrate suppliers/partners.
• Overall program management from conceptual phase to HVM.
• Good written and verbal communication skills are required.
• Ability to lead a x-functional team is a big plus.