What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

The Role

As a member of AMD's Packaging Engineering team, you will drive technology development and the initial Supply Chain bring up of advanced 2.5D/3D package architectures to support new AMD products.

The Person

• The candidate should have a proven track record and extensive knowledge/experience in Wafer Process Integration, such as BEOL Integration, 2.5D/3D integration with TSV, etc.
• He/she should have a hands-on approach to new process development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.

Key Responsibilities

• Identify, develop, and productize cutting edge advanced packaging for AMD products.
• Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements.
• Select development partners to bring into AMD supply chain to invest and develop these concepts.
• Partner with Product teams and Manufacturing Engineering to demonstrate reliability and smoothly transition new packaging technologies from concept through NPI.
• Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.

Preferred Experience

• Fundamental knowledge and hands on experience in BEOL technologies and TSV integration.
• Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
• Familiarity with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques for improved functionality at the lowest cost.

Academic Credentials

• BS/MS/PhD in Computer Science, Applied Mathematics, Electrical Engineering, Mechanical Engineering or equivalent.