What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

IC Packaging Integration Lead

IC Packaging Integration Lead The Role
As part of AMD's Package Engineering team, you will lead end to end new product development from concept to high-volume manufacturing. You will define packaging technology to support challenging product performance requirements, including BOM, signal integrity, thermo-mechanical, quality, cost, yield and reliability
The Person
 

• Experienced at leading products from the conceptual phase to high-volume production, including package definition, package design, bump/assembly development, substrate definition/manufacturing, qualification and yield improvement in package development integration role for high complexity packages.
• High aptitude for packaging development, including package design, bumping/CPI, package, substrate and assembly.
• Good knowledge of SI/PI and high speed interfaces (DDR, GDDR, PCIE, USB) and Package design (package layout, architecture, design rules, ballout/pin out development)
• Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM is required.
• Strong understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate with various package technology is required.
• In depth knowledge of package reliability (1st & 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions is preferred.
• Interact directly with OSAT/bumping/assembly/substrate suppliers/partners, Business units and customers.
  Key Responsibilities:
   

• Key customer interface for Packaging development.
• Lead Package development for complex products (large FCBGA, MCM, SCM, chiplet, etc) working with cross functional teams (SOC, Platform, Quality/Reliability, SI/PI, Package design, etc) for product enablement.
• Define package technology from conceptual phase with tradeoffs between cost, quality, reliability, performance and manufacturability.
• Lead and drive projects with OSATs and suppliers on assembly, bumping, package integration, substrate design/manufacturing, materials development, etc
• Lead Package development & NPI including pre/post silicon bringup, qualification, yield improvement, etc 
  Preferred Experience:
   

• End to end IC package development integration experience
• Prior hands on package development experience on complex packages (FCBGA, SCM, MCM, 2.5D/3D, WLFO, etc)
• Strong focus on flip chip, bumping/CPI, substrate, assembly, single chip, MCM, 2.5D/3D, packaging/substrate materials, chiplet technology (Fanout, InFO, CoWoS, FO-MCM, FoCoS, etc) and thin packaging.
• Good working knowledge of SI/PI, Package Design/layout & chiplet technologies.
• Good understanding of cross functional packaging areas including backend/assembly process technologies, 1st & 2nd level interconnect reliability, SI/PI, package design, thermal & mechanical.
  Academic Credentials:
   

• BS/MS/PhD in Mechanical, Electrical, Materials Science, Chemical Engineering or other relevant disciplines.

Location: Santa Clara, CA

#LI-TW1

• • • AMD is a government contractor and subcontractor. As required by Executive Order, our US employees are required to be fully vaccinated against COVID-19 regardless of the employee’s work location or work arrangement (e.g., telework, remote work, etc.), subject to such exceptions as required by law. If selected, you will be required to be vaccinated against COVID-19 and submit documentation of proof of vaccination by January 4, 2022. AMD will provide additional information regarding what information or documentation will be needed and how you can request an exception from this requirement if you have a need for a religious and/or medical accommodation.