What you do at AMD changes everything 
 

At AMD, we push the boundaries of what is possible.  We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies – building blocks for gaming, immersive platforms, and the data center. 
 

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the “extra mile” to achieve unthinkable results.  It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.   If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.
 

Fellow Wireless System Engineer - 116161

The Role:

Are you dedicated to Wireless system engineering?

We are looking for someone to Influence all aspects of wireless features within AMD’s Client SoC architecture team. Client architects guide a SoC from early concept stage through design execution and post silicon. This role involves collaboration with many teams across subject areas, including IP design, SoC integration and physical design, platform architecture, software, firmware, packaging, and silicon validation. You will impact every part of the wireless system and see your contributions in shipping products.

The Person:

The candidate should have strong analytical thinking and problem-solving skills with excellent attention to details. Must be organized, self-motivated and able to work optimally on teams small and large across sites. Able to prioritize multiple assignments and drive them to completion. Strong verbal and written communication skills are essential for driving technical conversations to successful outcomes.

Key Responsibilities:

• Ability to assess next generation user experience capabilities and transform those into innovative features
• Drive long lead innovation and IP including all levels of architectural technical details with a focus on aggressive differentiation
• Own all IP metrics (e.g. functionality, power, area), floor planning, performance power analysis and bounding box (e.g. GFX, multimedia, IO) power delivery, thermals, firmware, OS and drivers, etc.
• Generate long term client roadmap product concepts. Includes device partitioning, packaging, chiplets, etc.
• Customer engagement – will own some of the key strategic customer CTO office engagements (long term roadmap)
• Collaborate with cross-company engineering (Cores, IP, platform), and Business Unit leaders to deliver quality products at competitive costs and schedule
• Collaborate with industry leading wireless providers / partners

Preferred Experience:

• Demonstrated experience in principle investigation of new technology innovation where there is uncertainty and ambiguity
• Familiarity with the Electrical/RF and mechanical characteristics of MCM and chiplet technologies
• System partitioning, optimization and depth with Antennae Design
• Design for assembly and footprint optimization
• Detailed understanding of Transmit/Receive module circuitry
• Demonstrated experience with the structural and thermal characteristics for Radio/RF design
• Familiar with design techniques to reduce power consumption and with various wireless standards ASIC/SoC circuity
• Beam forming technology including modem to RF control and optimization
• Demonstrated successful career progression in the semiconductor industry building and delivering market leading products
• Sound and rapid decision-making skills, ability to handle ambiguity, and consistent visibility to leadership.
• Outstanding communications skills are vital – this leadership role requires continuous executive communication both internally and externally
• A strong understanding of system standards and future evolution
• A good understanding of software operation from device driver to OS, to application